Toshiba launches NFC(1) LSI for mobile payments

Toshiba Corporation (TOKYO:6502) today announced that it has launched an NFC controller LSI (CLF[2]) "T6NE2XBG" for secure mobile payments via proximity wireless communication. Mass production is scheduled to start in October.

The market for mobile payments, using smartphones and other mobile devices in transactions, is growing. The T6NE2XBG enables multiple concurrent connections with three different secure elements (SE[3]), allowing manufacturers to design NFC-enabled applications before the SE for the transaction system is determined.

Also read: Global mobile-payment transactions to touch $721bn: Gartner

Toshiba has shipped more than 400 million custom LSIs for proximity cards and mobile payment systems, and expertise in RF[4] technology gained through this experience is integrated in the new product. Toshiba is also developing an LSI for embedded SE, and plans to introduce a packaged product that incorporates CLF and SE.

A demo board of T6NE2XBG will be displayed at the Mobile Asia Expo 2013, to be held at Shanghai from June 26th to 28th.

Features

1. Concurrent connection to up to three multiple SEs

A range of SE are being deployed into applications to meet the different requirements of payment system operators. The new product enables multiple concurrent connections to a maximum of three different SEs, making it possible to design applications before the system SE is finalized. The product also supports thee different communication protocols to SEs.

2. Integrated circuit to adjust RF connectivity

Manufacturers need to adjust RF connectivity of NFC-enabled devices to receive necessary certification that payment system operators require. The product integrates an adjustment circuit and records each parameter into embedded EEPROM, which enables adjustment of each operating mode (card emulation, reader writer, and P2P[5]) and different RF modulation options (Type A, B and F).

Applications

Smartphones, tablet terminals, NFC readers/writers, and home appliances with wireless communication functions

Features of the New Product
Part Number		T6NE2XBG
Sample Price(Tax Included)		300Yen
Mass Production		October, 2013
Mass Production Volume		One Million pcs per month
Main Features		CPU:		ARM Cortex™-M0 [6]
		Max Operation Frequency:		27MHz
		Communication I/F:		RF:		ISO14443 TypeA/B,ISO18092 TypeF,ISO15693 (R/W mode only)
				Host I/F:		SPI I2C UART (option)
				SE IF:		3×SWP UART SPI (select 3 interfaces)
		Antenna Drive Current:		64mA (max value and settable step by step)
		Power Dissipation:		Stand-by: max 5μA, Card mode: max 5mA,R/W mode: max 10mA (antenna drive current excluded)
		Supply Voltage:		2.5V~3.3V (3 mixed power supply voltage)
		Package:		BGA64(4.5mm x 4.5mm, t0.85mm, 0.5mm pitch)
		Operation Temperature Range:		-30 to 85 degC
CLF Embedded Software		NFC Forum:		NCI Ver1.0 (2012/11/6) compliant
		EMVCo:		Book D EMV contactless communication protocol specification Ver. 2.2 compliant
		3 Secure Element I/F:		Application ID/Technology/Protocol base routing

Notes
[1]		NFC: Near Field Communication. One of the international standards for proximity wireless communication system.
[2]		CLF: Contactless Front-End. A kind of NFC controller.
[3]		SE: Secure Element. Semiconductor products which has security functions against masquerading attacks from outside.
[4]		RF: Radio Frequency.
[5]		P2P: Peer-to-pear. Communication systems that the either side can initiate a session and has equal responsibility.
[6]		ARM is a registered trademark and ARM Cortex is a trademark of ARM Limited in the EU and other countries.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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